Brief: Discover the WDS1800 Full Automated BGA Rework Machine, a high-precision, computer-controlled solution for effortless chip rework. Featuring 1200W pixel vision positioning, infrared + gas mixed heating, and eight-axis linkage, it’s perfect for BGA, QFN, CSP, and more. Ideal for high automation and batch rework.
Related Product Features:
Fully automated rework station with 1200W pixel vision positioning for accurate Marke point recognition.
Infrared + gas mixed heating method ensures precise temperature control for chip desoldering.
Independent eight-axis linkage with motor-driven movements for high automation and efficiency.
Three temperature zones (upper, lower, infrared) with automatic positioning for targeted heating.
Extra-large 550*400 mm infrared preheating platform with fast, even heating to prevent PCB deformation.
Built-in vacuum pump and 0-pressure suction for handling smaller chips with precision.
Industrial computer control with real-time temperature curve display and mass storage for over 10,000 curves.
Optional nitrogen gas inlet and cooling functions for safer, more reliable rework processes.
Interrogazioni:
What types of chips can the WDS1800 rework?
The WDS1800 is suitable for BGA, QFN, CSP, LGA, Micro SMD, MLF, POP, CCGA, and other challenging rework components.
How does the WDS1800 ensure precise positioning during rework?
It uses a 1200W pixel industrial vision camera to automatically recognize Marke point coordinates, achieving accuracy up to 10um.
Can the WDS1800 handle large PCBs?
Yes, it supports PCBs up to 640*490mm (customizable) with no rework dead ends, thanks to its unique X/Y direction mobile design.
What safety features does the WDS1800 include?
It has 2 sets of light grids that halt operation if obstructed, nitrogen gas protection, and cooling functions to protect chips and users.